Power Consumption

The values in this section are measured values of power consumption under the following conditions, except where noted:

• Operating conditions
  • V_VDDIN = 3.3 V
• Wake up time from sleep mode is measured from the edge of the wakeup signal to the execution of the first instruction fetched in flash.
• Oscillators
  • XOSC (crystal oscillator) stopped
  • XOSC32K (32 kHz crystal oscillator) running with external 32kHz crystal
  • DFLL48M using XOSC32K as reference and running at 48 MHz
• Clocks
  • DFLL48M used as main clock source, except otherwise specified
  • CPU, AHB clocks undivided
  • APBA clock divided by 4
  • APBB and APBC bridges off
• The following AHB module clocks are running: NVMCTRL, APBA bridge
  • All other AHB clocks stopped
• The following peripheral clocks running: PM, SYSCTRL, RTC
  • All other peripheral clocks stopped
• I/Os are inactive with internal pull-up
• CPU is running on flash with 1 wait states
• Cache enabled
• BOD33 disabled

• Table 1. Current Consumption

  Mode	Conditions	TA	Typ.	Max.	Units
  ACTIVE	CPU running a While(1) algorithm	125°C	3.75	4.12	mA
  	CPU running a While(1) algorithm VDDIN=1.8V, CPU is running on Flash with 3 wait states	125°C	3.77	4.13
  	CPU running a While(1) algorithm, CPU is running on Flash with 3 wait states with GCLKIN as reference	125°C	62*freq + 228	62*freq + 302	μA (with freq in MHz)
  	CPU running a Fibonacci algorithm	125°C	4.85	5.29	mA
  	CPU running a Fibonacci algorithm VDDIN=1.8V, CPU is running on flash with 3 wait states	125°C	4.87	5.29
  	CPU running a Fibonacci algorithm, CPU is running on Flash with 3 wait states with GCLKIN as reference	125°C	88*freq + 424	88*freq + 486	μA (with freq in MHz)
  	CPU running a CoreMark algorithm	125°C	6.70	7.30	mA
  	CPU running a CoreMark algorithm VDDIN=1.8V, CPU is running on flash with 3 wait states	125°C	5.98	6.41
  	CPU running a CoreMark algorithm, CPU is running on Flash with 3 wait states with GCLKIN as reference	125°C	108*freq + 426	108*freq + 492	μA (with freq in MHz)
  IDLE0	Default operating conditions	125°C	2.40	2.69	mA
  IDLE1	IDefault operating conditions	125°C	1.79	2.05
  IDLE2	IDefault operating conditions	125°C	1.50	1.76
  STANDBY	XOSC32K running RTC running at 1kHz(1)	125°C	348.0	850	μA
  	XOSC32K and RTC stopped(1)	125°C	346.0	848

  Note:

  1. Measurements were done with SYSCTRL->VREG.bit.RUNSTDBY = 1

  Table 2. Wake-up Time (SAMD21)

  Mode	Conditions	TA	Min.	Typ.	Max.	Units
  IDLE0	OSC8M used as main clock source, Cache disabled	125°C	3.9	4.0	4.1	μs
  IDLE1	IOSC8M used as main clock source, Cache disabled	125°C	13.5	14.9	16.4
  IDLE2	IOSC8M used as main clock source, Cache disabled	125°C	14.4	15.8	17.2
  STANDBY	IOSC8M used as main clock source, Cache disabled	125°C	19.2	20.6	22.1

Figure 1. Measurement Schematic