Thermal Characteristics

Table 1.
Standard Operating Conditions (unless otherwise stated)
Param No.	Sym.	Characteristic	Typ.	Units	Conditions
TH01	θ_JA	Thermal Resistance Junction to Ambient	59	°C/W	64-pin TQFP package
TH01	θ_JA	Thermal Resistance Junction to Ambient	28	°C/W	64-pin QFN package
TH02	θ_JC	Thermal Resistance Junction to Case	18	°C/W	64-pin TQFP package
TH02	θ_JC	Thermal Resistance Junction to Case	6	°C/W	64-pin QFN package
TH03	T_JMAX	Maximum Junction Temperature	150	°C
TH04	PD	Power Dissipation	—	W	PD=P_INTERNAL+P_I/O⁽³⁾
TH05	P_INTERNAL	Internal Power Dissipation	—	W	P_INTERNAL=I_DDxV_DD⁽¹⁾
TH06	P_I/O	I/O Power Dissipation	—	W	P_I/O=Σ(I_OLV_OL)+Σ(I_OH(V_DD-V_OH))
TH07	P_DER	Derated Power	—	W	P_DER=PD_MAX (T_J-T_A)/θ_JA⁽²⁾
Note: 1.I_DD is current to run the chip alone without driving any load on the output pins. 2.T_A = Ambient Temperature, T_J = Junction Temperature. 3.See "Absolute Maximum Ratings" for total power dissipation.